Experimental Investigation on Thermal Performance of Cooling System Using Thermoelectric Module Integrated with Heat Pipe

ARTICLE INFO Cooling of electronics component is one of the major challenges faced by thermal engineers. In recent years, a significant increase in microprocessor power dissipation coupled with CPU size has resulted in an increase in heat fluxes. Microprocessor heat fluxes have also increased for many commercial applications. Therefore, thermal management is becoming one of most challenging issues and an important subject in regard to cooling system performance. For a number of applications, direct air-cooling systems like by applying blower, fan or water cooling are having moving parts and not reliable for continuous operation for long time and will have to be replaced or enhanced by other high performance compact cooling techniques. Liquid–vapor phase change, impinging jets spray, the use of thermoelectric modules and heat pipes are attractive cooling solutions for removing high heat fluxes because of their high heat transfer coefficients. In the present work we perform the initial experimental investigation and basic mathematical modeling to determine the thermal performance of thermoelectric module integrated with heat pipe for electronics cooling at different operating variables and parameters. Currently the experiments are in progress, so we put our initial experimental setup and discussions. The detail results after experiments will help us to analyze the temperature distribution and heat transfer limitation characteristic in thermoelectric module and its role in future of electronics cooling. Keywords— Electronics Cooling, Thermoelectric, Heat Pipe,Thermal Performance Article History Received :18 th November 2015 Received in revised form :